The Upcoming SoC is expected to feature an Octa-core setup and an all new Adreno 630 GPU. Samsung has reportedly called first dibs on the SD 845 chipset from Qualcomm.
If rumours are true, Qualcomm’s next gen flagship SOC, the Snapdragon 845 may make its debut as soon as December this year. According to a leaked image circulating on Weibo, Qualcomm will be unveiling the Snapdragon 845 at the Snapdragon technology summit. The summit which is scheduled to happen from December 4-8, is taking place in Maui Island, Hawaii this year. Last year, Qualcomm held the event in November in New York, unveiling the Qualcomm Snapdragon 835 SoC. The chip was then formally announced at CES 2017 in January. Hence, given the history of the event, it is more than likely that we might see the next gen Snapdragon SoC being revealed at the event.
The Qualcomm Snapdragon 845 is expected to be an Octa-core SoC, just like the current gen Snapdragon 835 SoC. It is rumoured that the upcoming SoC will be powered by combination of ARM Cortex-A75 and Cortex-A53 cores. The graphics will be handled by Qualcomm’s new Adreno 630 GPU. Like the current gen, this new SoC is also expected to be manufactured by Samsung using the same 10nm FinFET process. Hence, it is not expected that the chip will be bring a huge improvement in battery efficiency.
With the expected release of the SoC in December – January time frame, we can expect it to feature in most flagship phones in the next year. We have seen reports that LG has begun work on deploying the Snapdragon 845 on its flagship and Samsung might be buying the entire first batch of the chip. We may also see smartphones offering the in-display fingerprint sensor in the next year which was demoed by Qualcomm earlier this year at MWC Shanghai.