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Huawei reportedly working on Kirin 1020 SoC to rival Qualcomm’s flagship chipsets


Huawei’s upcoming chipset will reportedly be twice as fast as its current flagship chipset and will come with a 5G modem. It will, however, take its time to launch.

The Kirin 970 has been powering Huawei phones for quite some time now and is long overdue for a refresh. Well, that upgrade is coming in the form of the Kirin 1020 which Chinese news website Anzhuo reports will be twice as fast as its predecessor.

HiSilicon, the Huawei subsidiary that manufactures silicon for Huawei and Honor phones is reportedly developing the Kirin 1020 to compete with Qualcomm’s dominance in the flagship segment. The Kirin 1020, if true, might be a big upgrade as the name suggests a new series. There’s also the Kirin 980 that is the most obvious successor to the earlier Kirin 970, which makes things even more interesting for the rumoured Kirin 1020.

The chipset is reportedly being manufactured by TSMC on its 7nm manufacturing process, same as the next flagship chipset as Qualcomm’s, indicating Huawei is serious in beating the top player this time. The Kirin 970, even though it comes with a discrete AI processor, cannot match up to the Snapdragon 845 in terms of raw performance.

The Kirin 1020 is being hyped to be twice as fast as the exisitng Kirin 970. However, the Kirin 1020 might not see the light of the day until 5G connectivity starts rolling out to markets. The chipset, according to the report, will then be ready for mass-production which hints at a 5G modem inside the chipset. It remains to be seen what devices will be powered by the chipset.

Huawei is also rumoured to be working on a Kirin 710 chipset. In case you were wondering, it does have the same model number as the Qualcomm Snapdragon 710 and apparently will target the same range of devices. Like the Snapdragon 710, the Kirin 710 will also attempt to bridge the gap between mid-range and flagship phones. The Kirin 710 will inherit the AI capabilities of its current flagship processor and will be made on a 12nm manufacturing process by TSMC . Reportedly, the upcoming Huawei Nova 3 will be the first device to be powered by the Kirin 710 chipset.